Corblivar is a simulated-annealing-based floorplanning suite for 3D ICs
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Jun 1, 2024 - C++
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3d-ic
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Source code for Multifidielity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures
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Jan 29, 2026 - Python
Corblivar is a simulated-annealing-based floorplanning suite for 3D ICs
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Updated
May 31, 2019 - C++
🔲 Chip substrate — 28-verb semiconductor stack (architecture / design / EDA / process / packaging / NPU / PIM / 3D / photonic / RTL-gen / yield / consciousness-chip).
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May 6, 2026 - Verilog
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